Koch-Chemie Micro Cut Pad Purple SOFT
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Description
High-quality special sponge for removing fine scratches, holograms and polishing marks 1using the Micro Cut and Micro Cut & Finish. The short height of 25mm creates low torsionforces, very good handling and the highest level of stability. The special density of the foammaterial enables long-lasting compression hardness during polishing. The optimisedreticulation (open cellular structure) and cell count contribute to a high-shine finish and verygood hygiene factors. The milling edge ensures extra flexibility for the pads, enabling themto fit around contours easier. The colourful non-woven material, suitable for polishing,ensures process safety. Optimization of compression hardness and cell structure for soft and sensitive paints.
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